Certification
Our Products
What are PCBs?
A printed circuit board, or PCBs, is a thin plate of insulating material used to support and connect electronic components. The term “printed circuit” refers to the fact that the electrical components are physically printed on the surface of the board. The boards are then typically sandwiched between layers of metal, which serve as conductors.
PCBs are found in most electronic devices and appliances–such as digital clocks, calculators, computer systems, cell phones, etc. In other words, they determine where the electricity will flow to power your device. Without PCBs, most electronics would not be able to function properly. As a result, PCBs must be carefully designed and manufactured to meet the demanding standards of the electronics industry.
PCBs can be single-sided (one conductive layer), double-sided (two conductive layers on both sides of the board), or multi-layer (outer and inner conductive layers with one or more insulating layers in between). Some of the more commonly used pre-preg materials in the PCBs industry are FR-2, FR-3, FR-4, FR5, FR -6, G10 CEM1, CEM 2, CEM 3, CEM 4, and CEM 5.
How PCBs Boards Works?
PCBs are flat boards made up of insulating material, like fibreglass, that support and connect electronic components using conductive tracks or traces. The tracks on a PCBs are very thin, so they need to be coated with a solder mask layer to protect them from being short-circuited by solder splatter during the soldering process.
To connect components using layers or vias, holes must be drilled through the board in the tracks. To finish, more holes are drilled around the periphery of the board so that components can then be soldered into place.
The solder mask is usually green and is made of copper-coated metal because it is an excellent conductor of electricity. After the solder mask is applied, the PCBs is ready for the silkscreen printing process. This is where the white legends or labels are printed on the board to indicate where each component should be placed.
Our Customers
Our OEM facilitator
Range of Products We Provide
Single Sided
Single Sided White Masking Aluminium
Single Dided
Double Sided Green Masking
Double Side
Double Side White Masking
Double Side Green Masking
Double Side Green Masking Lead Free HAL
Double Side Green Masking Carbon Link
Double Side Black Masking
6 Layer Blue Masking Immerse Gold
4 Layer Red Masking Immersed Gold
4 Layer
Double Sided Black masking
Industries We Serve
Automotive
Consumer Electronics
Industrial Electronics
Instrumentation & Medical
Telecommunication & RF
Lighting
Space & Defence
Our Technology Partners
Infrastructure
Our state-of-the-art infrastructure facility is equipped with the latest machines and equipment that enable us to manufacture world-class products. We partner with leading PCBs fabrication technology providers across the world to remain on the cutting edge of fabrication processes.
Our products are known for their high quality, precision, and durability. Our PLC-based auto-plating line ensures uniform copper distribution throughout the circuit, and a vertical double-side solder mask coating machine enables us to have both sides of the solder mask coated at one time.
Our glass-to-glass exposing offers high accuracy in solder masks, while our horizontal Hot Air Leveling machine helps to provide uniform levelling on SMT pads.
Our Enablers
Technical Capabilities
| Matrix | Capability | ||
| MAX. Layer Count | 12 | ||
| Max. PCS Size | 510*600mm | ||
| Min.PCS Size | 20*20mm | ||
| Max. Board Thickness | 3.20mm | ||
| Board Thickness Tolerance | +/-10% | ||
| Max. Aspect Ratio | 1:08 | ||
| Min Line Width/Space |
4 mil / 4 mil
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| (Inner Layer), Hoz | |||
| Min Line Width/Space |
4 mil / 4 mil
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| (Inner Layer), 1oz | |||
| Min Line Width/Space |
4 mil / 4 mil
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| (Outer Layer), Hoz + plating | |||
| Min Line Width/Space |
4 mil / 4 mil
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| (Outer Layer), 1oz + plating | |||
| Min Line Width/Space |
6 mil / 6 mil
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| (Outer Layer), 2oz | |||
| Line Width Tolerance | 10% | ||
| Min Annular Ring(Inner Layer) | 7 mil | ||
| Min Annular Ring(Outer Layer) | 5 mil | ||
| Min.D2C (Inner Layer) | 10 mil | ||
| Min.D2C (Outer Layer) | 10 mil | ||
| Min. PAD Size | 0.50mm | ||
| PTH Hole Size Tolerance | +/-0.10mm | ||
| NPTH Hole Size Tolerance | +/-0.15mm | ||
| Hole Location Tolerance | +/-0.05mm | ||
| Min.R Angle | 90 Degree | ||
| Min.Slot Size | 0.60mm | ||
| Slot Tolerance | +/-0.15mm | ||
| Outer line Size Tolerance | +/-0.15mm | ||
| Hole To Trace Tolerance | +/-0.15mm | ||
| Solder Mask Thickness | 15-30 micron | ||
| Solde Mask Misregistration | 4mil | ||
| Min Solder Dam(on laminate) | 3.5mil | ||
| Min Solder Dam(on copper) | 4mil | ||
| Min. Legend Height | 1.00mm | ||
| Min. Legend Width | 8mil | ||
| Surface Finish | HASL LF, HASL, ENIG, Immersion Tin, OSP | ||